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Heat Dissipating Silicone Adhesive Product List

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Heat-conducting silicone adhesive "DOWSIL(TM) SE 4450"

Thermal conductivity of 1.9 W/m·K! Achieving heat dissipation from delicate electronic components.

"DOWSIL(TM) SE 4450" is a one-component, gray, heat-curing silicone adhesive for heat dissipation. Before curing, it has fluidity, and after curing, it exhibits excellent strength. It is a solvent-free type with high tensile strength. After dispensing, it can fill and self-level. It is a versatile heat-curing type, and since it is one-component, there is no need to mix multiple components. 【Features】 ■ One-component - No need to mix multiple components ■ Solvent-free type ■ Fluidity - Can fill and self-level after dispensing ■ Versatile heat-curing type ■ High tensile strength ■ Thermal conductivity - Dissipates heat from delicate electronic components 1.92W * For more details, please download the PDF or feel free to contact us.

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Heat-conductive silicone adhesive 'DOWSIL(TM) SE 4485'

1-component type, room temperature curing with a short tack-free time and no need for an oven! UL 94 V-0 certified.

"DOWSIL(TM) SE 4485" is a white, semi-flowable, fast-drying, room-temperature curing thermal silicone adhesive. It is designed to provide efficient heat transfer for cooling modules such as lamps, communication devices, and power supplies, and it combines good adhesion and thermal conductivity. It has obtained UL 94 V-0 certification and contributes to improved work efficiency due to its short tack-free time. 【Features】 ■ One-component, room-temperature curing (short tack-free time, no oven required) ■ Semi-flowable ■ Short tack-free time ■ Good adhesion ■ Thermal conductivity ■ UL 94 V-0 certified *For more details, please download the PDF or feel free to contact us.

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Heat-conductive silicone adhesive 'DOWSIL SE 4486'

Excellent fluidity and quick-drying! A low molecular siloxane reduction product with high thermal conductivity.

"DOWSIL SE 4486" is a one-component, white, room-temperature curing thermal silicone adhesive. It is designed to have efficient thermal conductivity for cooling devices such as home appliances and has good adhesion properties. Being a one-component and room-temperature curing product, it has a short tack-free time and does not require an oven. It is semi-flowable and a low molecular siloxane reduced product. 【Features】 ■ One-component, room-temperature curing (short tack-free time, no oven required) ■ Semi-flowable ■ Good adhesion ■ Thermal conductivity 1.6W ■ Low molecular siloxane reduced product *For more details, please download the PDF or feel free to contact us.

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Heat-dissipating silicone adhesive

Gelest's PP2-TC01 is a non-flowing two-component thermally conductive silicone suitable for bonding electronic devices that require heat dissipation.

Features and Benefits • Thermal conductivity • Soft, compressible • Self-adhesive • Non-flowable and thermosetting • No curing by-products • Addition curing with platinum catalyst

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DOWSIL SE 9184 White RTV

UL94 V-0 certification obtained! Short tack-free time, no oven required.

"DOWSIL SE 9184 White RTV" is a thermal silicone adhesive designed to provide the necessary adhesion and thermal conductivity for cooling various electronic components. It is a one-component, room temperature curing product that is white, non-flowable, and fast-drying. Curing can also be accelerated by heating. It is a low molecular siloxane reduced product and is solvent-free. Please feel free to contact us when you need it. 【Features】 ■ One-component, room temperature curing (short tack-free time, no oven required) ■ Curing can also be accelerated by heating ■ Non-flowable ■ Thermal conductivity ■ UL 94 V-0 (flame retardant) *For more details, please download the PDF or feel free to contact us.

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Heat-conductive silicone adhesive 'DOWSIL(TM) SE 4420'

1-component type, white moisture-curing type! Suitable for cooling electrical products including communication and power supply.

"DOWSIL(TM) SE 4420" is a moisture-curing thermal conductive silicone adhesive suitable for efficiently cooling electrical products, including communication and power supply devices. It has a thermal conductivity of 0.9 W/mK and achieves an adhesion strength of 2.7 MPa with aluminum lap shear joints. Additionally, the tack-free time is 8 minutes, and the elongation at break exceeds 75%. Please feel free to contact us if you need assistance. 【Features】 ■ Thermal conductivity: 0.9 W/mK ■ Room temperature curing: Moisture exposure ■ Adhesion strength: 2.7 MPa aluminum lap shear joint ■ Tack-free time: 8 minutes ■ Elongation at break: Exceeds 75% *For more details, please download the PDF or feel free to contact us.

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Heat-dissipating silicone adhesive "DOWSIL(TM) SE 4490 CV"

Non-flowable low molecular siloxane reduction product! Dissipates heat from electronic components to improve reliability.

"DOWSIL(TM) SE 4490 CV" is a one-component, white, room-temperature curing thermal silicone adhesive. It has good thermal conductivity and is suitable for cooling automotive control modules, power supplies, and display driver ICs. Designed for efficient thermal conductivity, it is a low molecular weight siloxane reduced product. Please feel free to contact us if you need assistance. 【Features】 ■ Non-flowable ■ Good thermal conductivity ■ Low molecular weight siloxane reduced product ■ Dissipates heat from electronic components to improve reliability *For more details, please download the PDF or feel free to contact us.

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